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Internal Component Location Oracle Sparc T8-1
Posted by Sandi Widianto, Last modified by Sandi Widianto on 23 November 2022 02:46 PM
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Internal Component Locations
The following figure identifies the replaceable component locations with the top cover removed.
Note - The two memory risers are optional.
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1
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Drive cage (drive backplane on the rear of the drive cage)
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/SYS/DBP
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2
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Fan module cover
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3
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Fan modules
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As viewed from front of server:
/SYS/MB/FM0 (left)
/SYS/MB/FM1 (left center)
/SYS/MB/FM2 (right center)
/SYS/MB/FM3 (right)
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4
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Airflow cover
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5
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Top cover
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6
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Memory risers
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/SYS/MB/CM/CMP/MR0
/SYS/MB/CM/CMP/MR1
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7
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DIMMs on memory risers
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/SYS/MB/CM/CMP/MR[0-1]/BOB[0-3]1/CH[0-1]/DIMM
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8
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DIMMs on motherboard
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/SYS/MB/CM/CMP/BOB[0-3]0/CH[0-1]/DIMM
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9
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PCIe cards
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/SYS/MB/PCIE1
/SYS/MB/PCIE2
/SYS/MB/PCIE3
/SYS/MB/PCIE4
/SYS/MB/PCIE5
/SYS/MB/PCIE6
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10
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Battery
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/SYS/MB/BAT
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11
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SPM
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/SYS/MB/SPM
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12
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Power supplies
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/SYS/PS0 (outer)
/SYS/PS1 (inner)
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13
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Motherboard
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/SYS/MB
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14
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Chassis
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15
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Drives
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/SYS/DBP/HDD0 (lower left)
/SYS/DBP/HDD1
/SYS/DBP/HDD2 or /SYS/DBP/NVME0
/SYS/DBP/HDD3 or /SYS/DBP/NVME1
/SYS/DBP/HDD4 or /SYS/DBP/NVME2
/SYS/DBP/HDD5 or /SYS/DBP/NVME3
/SYS/DBP/HDD6
/SYS/DBP/HDD7 (right)
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Processor chip (replaceable only by replacing the motherboard)
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/SYS/MB/CM/CMP
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eUSB drive
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/SYS/MB/EUSB_DISK
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